Work for CEIT and TECNUN Intels
Text created by automatic translator Elia and has not been subsequently revised by translators. Elia Elhuyar
The CEIT technology center and the TECNUN university school have signed an agreement with Intel to conduct joint research. The project aims to improve structures much lower than a micron, especially in their capacity for adhesion.
In fact, the microprocessors of computers are built with a superimposed structure or layer, so it is important to improve the adhesion of these structures. This will improve the functionality of microprocessors, resulting in more information and faster transport.
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